Beat 01
Rigid OLED
Deposition and anneal uniformity across large mother glass, with Mura false-call reduction as the fastest measurable win at cell test.
Solutions
Built for how your line actually loses yield
Rigid and flexible OLED, LTPS and oxide backplanes, microLED pilot and volume lines, and module assembly — each with a different first workflow.
- OLED
- LTPS / LCD
- microLED
- Module assembly
Line types Emiteon is designed for
Gen-8.6 OLED fabFlexible OLED module lineAutomotive display makermicroLED pilot lineAR/VR microdisplay groupLTPS array fab
By line type
The same loop, a different wedge
Beat 02
Flexible OLED
Added mechanical and encapsulation variability makes uniformity harder and inspection noisier — the perception layer earns its keep here first.
Beat 03
LTPS and oxide backplanes
Threshold-voltage and mobility spread across the array is the root cause behind non-uniformity that only becomes visible downstream.
Beat 04
microLED
Mass-transfer and repair yield is the economic ceiling. Placement, bonding and repair prioritisation are where the loop pays for itself.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Wedge selection
How we choose the first workflow
The first deployment is chosen on measurability, not on breadth.
Step 1 of 5 · baseline
Find the number that already hurts
False-call rate, scrap, ramp weeks or transfer yield — whichever your team already reports to leadership every week.
Step 2 of 5 · scope
Scope to one tool or line
One inspection line or one tool set, so the effect is attributable and the rollback is trivial.
Step 3 of 5 · instrument
Instrument in shadow
No write-back until predicted performance is proven against your own labels.
Step 4 of 5 · prove
Prove on a single metric
One agreed success metric, tied to the pricing metric, evaluated at a fixed date.
Step 5 of 5 · expand
Expand tool by tool
Adjacent tools, then adjacent modules, then adjacent fabs.
By workflow
Where the loop lands first
Mura and defect review
Suppress nuisance calls, keep real excursions, and attach the evidence behind every call.
- Cell-test Mura
- Sub-pixel opens and shorts
- Particles and stains
Deposition and anneal control
Predict and correct drift inside the process window.
- Thickness and overlay
- Chamber matching
- Vth and mobility
Transfer and repair
Raise transfer yield and route repair effort by recovered value.
- Placement and bonding
- Repair prioritisation
- Known-good-die routing
Ramp and excursion response
Turn every excursion into a shorter ramp next time.
- Root-cause ranking
- Ramp playbooks
- Scrap reduction
By role
What each team gets on day one
Adoption fails when the value is only visible to one function.
Fab and manufacturing operations
Yield, scrap and ramp reported against a baseline you set, not against our marketing numbers.
Process integration and yield
Drift caught inside the window, with the evidence chain to argue the root cause.
Quality and reliability
An immutable record that survives a customer audit or a field return.
IT / OT and security
Tenant isolation, SSO/RBAC and an on-prem or air-gapped option.
Equipment engineering
Write-back through SECS-GEM with a fail-safe stop on every path.
Finance
A pricing metric that maps to tools and fabs you already count.
Outcomes
What we are measured on
Fewer false calls
Engineer hours returned to real excursions instead of disproving nuisance signals.
Higher first-pass yield
Drift corrected before the panel is made, not detected after.
Faster ramp
Manual tuning cycles compressed from quarters toward weeks.
Lower scrap and rework
Bin and repair decisions weighed against recovered value and demand mix.
Retained process knowledge
Engineer corrections become models, so expertise stops leaving with people.
Adoption
Land narrow, expand on evidence
Fabs do not buy platforms; they buy a fixed loss going away. Emiteon lands on one workflow with a hard success metric, then expands tool by tool, module by module and fab by fab as each expansion earns it.
- Single-workflow pilot with an agreed metric
- Expansion gated on measured results, not on renewal dates
- Multi-fab governance once two lines are live
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Fit
It has to work with what is already installed
Deposition, litho and encapsulation
Vacuum depositionInkjet/TFE encapsulationPhotolithographyOverlay metrologyChamber telemetry
Anneal and TFT process
Excimer laser annealThermal annealVth metrologyLTPS/oxide array
Inspection, metrology and test
Mura/AOI systemsOptical uniformityArray testCell testAging
Transfer, repair and handling
Mass-transfer headsLaser repairPanel roboticsCassette logistics
Voices from the line
What the fab floor tells us
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
What the loop is measured on
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
$26BDisplay-fab automation, process control, inspection, test and fab software market
~14%Annual growth in the segments Emiteon plays in
135%Net revenue retention target from land-and-expand
99.9%Uptime target for the fab edge runtime
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Questions fabs ask first
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
Find your wedge workflow
Bring the number you already report every week. We will tell you honestly whether the loop can move it.