Beat 01
Uniformity drifts before anyone sees it
Deposition and anneal drift accumulates across a mother glass for hours before it shows up as visible Mura at cell test — by then the panels are already made.
Autonomous operations for display manufacturing
Every pixel,perfectly uniform.
Emiteon is the autonomous operations layer for OLED, microLED and flat-panel fabs — a closed perception-to-control loop that holds uniformity, kills Mura false calls and compresses new-product ramp.
7fab-edge agents
1orchestrated loop
3autonomy gates
0recipes leave your tenant
Drift sensedMura classified, false calls suppressedRecipe and transfer corrected
Built for the lines that make the panels you look at all day
Gen-8.6 OLED fabFlexible OLED module lineAutomotive display makermicroLED pilot lineAR/VR microdisplay groupLTPS array fab
Design-partner categories shown. Named references are [PLACEHOLDER] pending consent.
The problem
A panel fab loses margin in the gaps between tools
Beat 02
Inspection drowns in nuisance calls
Mura and AOI systems flag far more than they should. Engineers spend their day disproving calls instead of fixing the process that caused the real ones.
Beat 03
Transfer yield caps microLED
Millions of emitters per panel means every fractional transfer loss is a repair cycle, a scrapped backplane, or a product that never reaches cost parity.
Beat 04
Ramp is manual and slow
New products are tuned by hand across quarters. The knowledge lives in a handful of engineers and leaves with them.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
The loop
One closed loop from substrate to bin
Scroll through the seven stages the orchestrator runs on every panel. Each stage feeds the next, and every correction feeds the models.
Step 1 of 7 · perceive
Perceive the panel, not the tool
Substrate, TFT array, emitter stack and individual sub-pixels are modelled together, so a signal on one layer is read in the context of every layer beneath it.
Step 2 of 7 · plan
Plan the move that protects yield
The orchestrator plans deposition, anneal, transfer, test and bin actions against the current yield, demand mix and risk budget — not against a static recipe table.
Step 3 of 7 · act
Act through the interfaces the fab already trusts
Recipe and setpoint write-back travels over SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere. Nothing bypasses fab governance.
Step 4 of 7 · sense
Sense what actually happened
Mura ΔL*, sub-pixel opens and shorts, particles, overlay and Vth maps come back as measurement, closing the loop on the action rather than assuming it worked.
Step 5 of 7 · optimise
Optimise yield, ramp and scrap together
Single-metric optimisation is how fabs trade one loss for another. The loop weighs yield, ramp time and scrap as one objective.
Step 6 of 7 · log
Log every decision immutably
Each action writes a signed, yield- and quality-grade audit entry: what was sensed, what was decided, who approved it and what changed.
Step 7 of 7 · retrain
Retrain on engineer corrections
Every override is a label. Corrections from process, yield and quality engineers flow back into the models that made the call.
The agents
Seven agents, one orchestrator
Each agent owns a process domain. The orchestrator sequences them so a decision in deposition is made knowing what test and bin will see.
01
deposit-and-pattern
Holds emitter-stack and TFT layer uniformity across the whole mother glass by closing the loop between chamber telemetry, overlay metrology and recipe write-back.
- Thickness and overlay drift prediction
- Chamber-to-chamber matching
- Recipe write-back over SECS-GEM
02
tft-and-anneal
Stabilises threshold voltage and mobility across the panel so backplane variation never becomes visible non-uniformity at cell test.
- Excimer and thermal anneal control
- Vth / mobility mapping
- Array-test correlation
03
mura-and-defect
Separates real large-area non-uniformity, sub-pixel opens and shorts, particles and stains from the nuisance signals that swamp inspection queues.
- True-versus-false-call classification
- Sub-pixel and particle detection
- Evidence-linked calls
04
microled-transfer
Optimises mass transfer and repair — the yield ceiling on microLED — by learning placement, bonding and repair outcomes emitter by emitter.
- Placement and bonding parameters
- Repair-cycle prioritisation
- Known-good-die routing
05
panel-handling
Coordinates robotic panel and cassette movement so large, fragile substrates move without breakage, particles or queue stalls.
- Breakage and particle risk scoring
- Cassette logistics
- Fail-safe stop to known-good state
06
age-test-and-bin
Runs aging, test and binning decisions with the demand mix in view, so grade calls maximise value instead of defaulting to the safest bin.
- Aging and burn-in analysis
- Grade and bin optimisation
- Demand-aware routing
The platform
What Emiteon puts beside your tools
A fab-edge runtime, a panel-and-line twin, an audit spine and a review console that process engineers actually use.
Fab edge runtime
Deterministic execution beside the tools. Runs without the cloud, survives network loss, and drops autonomy to advisory rather than acting on a weak signal.
Panel-and-line digital twin
Hit uniformity and yield in simulation before the run touches glass.
Immutable audit log
Signed, yield- and quality-grade records of what was sensed, decided, approved and changed.
Review console
Where process-integration, yield and quality engineers approve, override and correct — and where every override becomes a training label.
Fleet learning
Model improvements travel across the fleet. Your recipes, panel designs and defect images never do.
Trust
Autonomy is earned in three gates, never assumed
No fab hands a tool to software on day one, and we do not ask them to. Emiteon starts in shadow mode, graduates to advisory, and only then takes graduated control of low-risk actions once measured accuracy and twin validation clear the bar.
- Shadow: observe and predict, zero write-back
- Advisory: recommend recipe, transfer and bin moves for engineer approval
- Graduated autonomy: low-risk control, high-impact decisions stay human-in-the-loop
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Integrations
Vendor-neutral across the tools you already run
Emiteon connects through the interfaces your fab already governs rather than asking you to replace them.
Deposition, litho and encapsulation
Vacuum depositionInkjet/TFE encapsulationPhotolithographyOverlay metrologyChamber telemetry
Anneal and TFT process
Excimer laser annealThermal annealVth metrologyLTPS/oxide array
Inspection, metrology and test
Mura/AOI systemsOptical uniformityArray testCell testAging
Transfer, repair and handling
Mass-transfer headsLaser repairPanel roboticsCassette logistics
Fab systems
MESSECS-GEM / HSMSYield managementHistorian / OPC-UASSO and identity
Notification and workflow
TicketingShift handoverAlertingReporting surfaces
Where it lands
Start on one wedge workflow
Mura false-call reduction
Cut the nuisance queue on cell test so engineers spend their time on the excursions that are actually costing panels.
Deposition and anneal uniformity
Hold thickness, overlay and Vth across the mother glass instead of chasing drift after the fact.
microLED transfer yield
Raise placement and bonding yield and prioritise repair cycles by value, not by queue order.
New-product ramp
Compress the manual tuning cycle so a new model reaches target yield in weeks instead of quarters.
Pricing
Priced on the metric you already manage
Land on one workflow with a hard success metric, then expand tool by tool, module by module, fab by fab.
Line
$16,000
per tool or inspection line / month
Panel makers validating ROI on the wedge workflow.
- Deposition/anneal-control, Mura/defect-vision or microLED transfer-optimisation AI for one tool or line
- Fab-edge runtime with central model management
- SECS-GEM connectors for the wedge tool stack
- Review console for process and yield engineers
- Immutable, yield/quality-grade audit log
Fab
$110,000
per fab / month
Scaling fabs adopting the full closed loop.
- Deposit and pattern + TFT and anneal agents
- Mura and sub-pixel/particle defect sensing
- microLED transfer and repair optimisation
- Robotic panel handling, age/test/bin, yield and ramp
- Panel-and-line digital twin: hit uniformity and yield before the run
Enterprise
Custom
land $700k–$8M ACV
Panel makers and display groups standardising on Emiteon.
- Multi-fab rollout and governance
- Custom process, defect and yield models
- Fab edge fleet management and OTA updates
- On-prem or air-gapped deployment option
- SLAs, security review and dedicated support
Voices from the line
What the fab floor tells us
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
What the loop is measured on
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
$26BDisplay-fab automation, process control, inspection, test and fab software market
~14%Annual growth in the segments Emiteon plays in
135%Net revenue retention target from land-and-expand
99.9%Uptime target for the fab edge runtime
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Questions fabs ask first
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
Bring the loop to one line
A design-partner pilot starts in shadow mode on a single workflow with a single agreed success metric. No fab-wide commitment to find out if it works.