Beat 01
Gen-6 flexible OLED fabs
Highest inspection noise, hardest uniformity problem, and the clearest measurable win from false-call reduction.
Customers
Who runs the loop
Emiteon is early. These are the fab profiles we are building with, described honestly — named references will appear here only with design-partner consent.
- Design-partner stage
- Anonymised profiles
- Consent-gated references
Fab profiles in the design-partner program
Gen-8.6 OLED fabFlexible OLED module lineAutomotive display makermicroLED pilot lineAR/VR microdisplay groupLTPS array fab
Categories, not logos. We do not display a customer mark without written consent.
Profiles
Who we build with
Beat 02
Automotive display makers
Reliability requirements and long warranty tails make the immutable audit log valuable on its own.
Beat 03
microLED pilot lines
Transfer and repair yield is the difference between a demo and a product; the loop targets it directly.
Beat 04
Module and assembly lines
Handling, particles and bin decisions dominate, and robotic coordination pays back quickly.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Program
What a design partner signs up for
Clear obligations on both sides, written down before the first connector is installed.
Step 1 of 6 · access
Tool and data access
Historical inspection and process data plus a scoped path to the wedge tools.
Step 2 of 6 · sponsor
An executive sponsor
Someone who owns the metric and can clear the IT/OT review.
Step 3 of 6 · baseline
An honest baseline
The current number, measured before we start.
Step 4 of 6 · time
Engineer time
A few hours a week from the team that owns the workflow.
Step 5 of 6 · feedback
Structured feedback
Overrides with reasoning, not just rejections.
Step 6 of 6 · decision
A decision date
A fixed point where the metric decides the outcome.
What partners get
The other side of the bargain
Preferential pricing
Design-partner terms held through the first expansion.
Roadmap influence
Your wedge workflow shapes what ships next.
Custom model work
Models trained on your dispositions, not on a generic dataset.
Direct engineering access
The people building the agents, not a support tier.
Security review support
Documentation and evidence for your IT/OT process.
Publication control
Nothing about your fab is published without written consent.
Discovery
What we heard before we built anything
“Nobody wants another dashboard. We want the false calls to stop arriving.”
“If your software writes a recipe, I need to know exactly what it wrote and who let it.”
“Show me it works in shadow for a quarter and then we can talk about control.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
Honesty
What we will not claim
Emiteon is at design-partner stage. Company operating status, customer names and outcome numbers on this site are aspirational or placeholder until they are independently verifiable. We would rather lose a deal than fabricate a reference.
- No unnamed 'Fortune 500' claims
- No outcome numbers without a stated baseline and method
- No customer logos without written consent
- Targets labelled as targets
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Environment
What we expect to find on site
Deposition, litho and encapsulation
Vacuum depositionInkjet/TFE encapsulationPhotolithographyOverlay metrologyChamber telemetry
Anneal and TFT process
Excimer laser annealThermal annealVth metrologyLTPS/oxide array
Inspection, metrology and test
Mura/AOI systemsOptical uniformityArray testCell testAging
Transfer, repair and handling
Mass-transfer headsLaser repairPanel roboticsCassette logistics
Voices from the line
What the fab floor tells us
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
What the loop is measured on
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
$26BDisplay-fab automation, process control, inspection, test and fab software market
~14%Annual growth in the segments Emiteon plays in
135%Net revenue retention target from land-and-expand
99.9%Uptime target for the fab edge runtime
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Questions fabs ask first
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
Join the design-partner program
Six to eight fabs, one wedge workflow each, and a decision date on every one.