Beat 01
Equipment OEM
Ship tools that are ready for closed-loop control. Joint validation of write-back paths, fail-safe behaviour and telemetry completeness.
Partners
The loop only works with the tools already installed
Equipment OEMs, inspection and metrology vendors, systems integrators and regional channel partners across Korea, Japan, China and Taiwan.
- Equipment OEM
- Inspection
- Integrators
- Channel
Partner categories
Deposition OEMAnneal systemsInspection and metrologyMass transfer and repairPanel roboticsMES and yield software
Programs
Four ways to partner
Beat 02
Inspection and metrology
Your signals are the perception layer's raw material. Deeper integration means better classification and fewer nuisance calls for a shared customer.
Beat 03
Systems integrators
Commissioning, baselining and connector work at fab scale, delivered by teams already trusted on site.
Beat 04
Regional channel
Local presence, language and relationships in the display manufacturing centres where the fabs are.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
How it works
From first conversation to joint deployment
Technical fit first, commercials second.
Step 1 of 6 · fit
Technical fit
What your tool or system exposes and what the loop needs.
Step 2 of 6 · lab
Lab integration
Connector work and validation outside a production line.
Step 3 of 6 · validate
Joint validation
Write-back, fail-safe and telemetry behaviour proven together.
Step 4 of 6 · pilot
Shared pilot
A design-partner fab where both of us are already trusted.
Step 5 of 6 · enable
Enablement
Documentation and training for your field teams.
Step 6 of 6 · scale
Scale
Repeatable joint deployments with agreed commercials.
Benefits
What partners get
Technical integration support
Engineering time to make the connector work properly, not just to make it exist.
Joint validation
Documented write-back and fail-safe behaviour for shared customers.
Co-selling
Joint pursuit of design-partner fabs where we both add value.
Enablement material
Documentation and training for your field applications teams.
Roadmap visibility
Early sight of connector and agent work relevant to your systems.
Regional support
Coverage across the display manufacturing centres.
Surface area
Where partner systems connect
Deposition, litho and encapsulation
Vacuum depositionInkjet/TFE encapsulationPhotolithographyOverlay metrologyChamber telemetry
Anneal and TFT process
Excimer laser annealThermal annealVth metrologyLTPS/oxide array
Inspection, metrology and test
Mura/AOI systemsOptical uniformityArray testCell testAging
Transfer, repair and handling
Mass-transfer headsLaser repairPanel roboticsCassette logistics
Fab systems
MESSECS-GEM / HSMSYield managementHistorian / OPC-UASSO and identity
Notification and workflow
TicketingShift handoverAlertingReporting surfaces
Program tiers
What each level involves
Tiers describe depth of integration, not exclusivity.
| Tier | Integration | Commercial |
|---|---|---|
| Connected | Validated read-only connector | Referral |
| Integrated | Validated read and governed write-back | Referral and co-sell |
| Joint solution | Co-engineered workflow with shared validation | Co-sell with joint deployment |
| Channel | Delivery and support capability in region | Reseller terms |
For OEMs
Closed-loop-ready is becoming a purchasing criterion
Fabs are starting to ask whether a tool can participate in a control loop safely — complete telemetry, governed write-back and predictable fail-safe behaviour. Joint validation makes that answer easy.
- Telemetry completeness reviewed against real agent needs
- Write-back paths validated with fail-safe behaviour documented
- Reference integration your customers can ask about
- No exposure of your customers' recipes to us or anyone else
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Voices from the line
What the fab floor tells us
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
What the loop is measured on
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
$26BDisplay-fab automation, process control, inspection, test and fab software market
~14%Annual growth in the segments Emiteon plays in
135%Net revenue retention target from land-and-expand
99.9%Uptime target for the fab edge runtime
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Questions fabs ask first
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
Let us make your tools closed-loop-ready
Start with one connector and one shared customer.