Beat 01
Scoping call
Thirty minutes on the workflow, the tools involved and the metric. No slides unless you want them.
Contact
Tell us the workflow and the number it costs you. We will tell you honestly whether the loop can move it.
Get in touch
The fastest conversations start with a specific line, a specific loss and a number someone already reports.
What happens next
Beat 01
Thirty minutes on the workflow, the tools involved and the metric. No slides unless you want them.
Beat 02
With your process, yield and equipment engineers — what signals exist, what interfaces are available and what governance applies.
Beat 03
Your IT/OT and IP teams get the architecture documentation before anything is installed.
Beat 04
Written scope, baseline method, success metric, timeline and conversion terms.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Who to contact
Fabs wanting to run a scoped pilot on one wedge workflow.
Architecture documentation, questionnaires and air-gapped deployment.
Equipment OEMs, inspection vendors, integrators and channel.
Roles across perception, control, robotics, simulation and field.
We will not confirm a customer name without their written consent.
For deployed design partners, with your named engineer on the thread.
Preparation
None of this is required, but each one shortens the path.
Step 1 of 6 · line
Type, generation and products running on it.
Step 2 of 6 · loss
The number you already report and what it costs.
Step 3 of 6 · tools
Which tools and inspection systems are in scope.
Step 4 of 6 · data
What historical inspection and process data exists.
Step 5 of 6 · governance
Who has to approve a connector and a write-back path.
Step 6 of 6 · date
When you would want a decision.
Response times
We are a small team and we answer everything ourselves.
| Enquiry | Typical response |
|---|---|
| Design partnership | Within two business days |
| Security questionnaire | Within five business days |
| Partner enquiry | Within five business days |
| Careers | Within one week |
| Press | Within two business days |
| Deployed-partner support | Per your SLA |
Before you write
We would rather set expectations now than in the third meeting. Emiteon is at design-partner stage, pilots are paid, and we will not show you another fab's data.
# closed loop, one panel
perceive substrate → tft → emitter stack → sub-pixel
plan deposition · anneal · transfer · test/bin
act recipe write-back (SECS-GEM)
sense mura ΔL* · sub-pixel opens · particles
optimise yield · ramp · scrap
log immutable audit entry ✓ signed
retrain engineer correction → model
Before the call
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Meanwhile
Voices from the line
“We do not lose panels because nobody is watching. We lose them because the signal that mattered was buried under a thousand nuisance calls.”
“Ramp is the whole game. If a new product takes two quarters of manual tuning, that is two quarters of margin we never get back.”
“Transfer yield is our ceiling on microLED. Every dead emitter is a repair cycle or a scrapped backplane.”
Quotes are illustrative composites drawn from discovery interviews with process-integration, yield and quality engineers. Named references are [PLACEHOLDER] pending design-partner consent.
The economics
Emiteon is priced and evaluated on the numbers a fab already reports. These are design-partner targets for the first twelve months of deployment.
Figures marked as targets are design-partner objectives, not audited results. Company operating status, customers and outcomes are [ASPIRATIONAL] until independently verified.
FAQ
Through three gates. Shadow mode observes and predicts with no write-back; advisory mode recommends recipe, transfer and binning moves that a process-integration or yield engineer approves; graduated autonomy releases low-risk deposition, anneal and transfer control once measured accuracy and twin validation clear the bar. High-impact decisions stay human-in-the-loop.
Reducing false calls is the wedge, not a side effect. The mura-and-defect agent is trained on true-versus-false-call labels from your own inspection history, so it separates genuine large-area non-uniformity, sub-pixel opens and shorts, particles and stains from nuisance signals, and every call is traceable to the evidence behind it.
Per-tenant isolation with recipes, panel designs and defect images scoped to your tenant, encryption in transit and at rest, SSO/RBAC, an immutable yield/quality-grade audit log and an on-prem or air-gapped option. Fleet learning shares model improvements, never your recipes.
Deposition, photolithography, encapsulation and anneal tools, Mura/AOI inspection and metrology, array and cell test, mass-transfer and repair stations, robotic handling and MES — vendor-neutral via SECS-GEM/HSMS where the tool supports it, with REST and OPC-UA bridges elsewhere.
Every pixel, perfectly uniform.
That is all a first engagement needs to be.